A heat sink is a device that incorporates a fan or another mechanism to reduce the temperature of a hardware component (e.g., processor). There are two heat sink types: active and passive. The picture is an example of a heat sink with both active and passive cooling mechanisms.
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The material used partly determines the extent of thermal conductivity. Copper and aluminum are the most widely used materials, though aluminum is the more common choice because copper is more expensive and heavier. Aluminum 6061 and 6063 are widely used with a thermal resistance of 166 and 201 W / mK, respectively.
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