New insulation available for flexible electronics

A team from the Korea Advanced Institute of Science and Technology (KAIST) has developed a high-performance, ultrathin polymeric insulator for field-effect transistors. Using vaporized monomers to successfully produce polymeric films on a variety of surfaces, such as plastics, these ubiquitous insulators provide the basis for future electronic device applications. The study was published online March 9 in Nature Materials.

In modern electronic devices used in our daily lives, from mobile phones and computers to flat panel displays, field effect transistors are ubiquitous. In addition to the three electrodes (gate, source and drain), the FET includes an insulating layer and a semiconductor channel layer. The insulating layer in the FET can effectively control the conductivity of the semiconductor channel to control the current in the transistor. In order to make the FET stable operation at low power, the application of ultra-thin insulating layer is very important. Because inorganic materials such as oxides and nitrides have excellent insulation and reliability, the insulating layer is usually made of such an inorganic material on hard surfaces such as silicon and glass.

However, due to the high hardness and high process temperature of these insulation layers, they are difficult to use in flexible electronic equipment. In recent years, a large number of researchers have studied polymer as a prospective optimistic insulating material for flexible non-traditional substrates and emerging semiconductor materials. However, the traditional technique of preparing polymeric insulators to cover the surface of extremely small thickness is still insufficient, preventing the FETs using polymer insulators from operating at low voltage.

A team led by Sung Gap, a professor of biochemical engineering at the Korea Institute of Science and Technology (KAIST), and Professor Seungghyup Yoo and Byung Jin Cho of the Department of Electrical Engineering developed an organic polymer "pV3D3" insulation. The insulating layer is made using a fully dry gas phase technology called "Chemical Vapor Deposition (iCVD)", which allows it to shrink enough in thickness to 10 nanometers (nm) without losing its perfect insulating properties.

iCVD process is to make the gaseous monomer and initiator in a low vacuum contact with each other, and ultimately deposited on the substrate conformal polymer film has good insulation properties. Unlike traditional techniques, iCVD's very uniform and pure ultra-thin polymeric films are produced in a large area that is virtually free of surface or bottom constraints and the problems associated with surface tension are resolved. And most iCVD polymers are generated at room temperature, reducing the strain on the substrate and resulting damage.

Using pV3D3 insulation, the research team has developed low-power, high-performance FETs that utilize a variety of semiconductor materials such as organic materials, graphene and oxide, demonstrating the versatility of pV3D3 for a wide range of materials. They also used conventional packaging tape as a substrate to create a sticky, removable electronic component. In collaboration with Professor Yong-Young Noh at Dongguk University in Korea, the research team succeeded in developing a transistor array on a large, flexible substrate in conjunction with the pV3D3 dielectric.

Im said: "The small size and wide applicability of pV3D3 made with iCVD technology are unprecedented for polymeric insulators, and even though the thickness of our iCVD pV3D3 polymeric film has been reduced to less than 10 nanometers, Of the insulation is still comparable to the inorganic insulation and we expect this to be a major benefit for the development of flexible electronic devices that will play a key role in the success of emerging electronic devices such as wearable computers. "

Summary: Researchers have developed a high-performance, ultrathin polymeric insulator for field-effect transistors (FETs). Using vaporized monomers to successfully produce polymeric films on a variety of surfaces, such as plastics, these ubiquitous insulators provide the basis for future electronic device applications.

This schematic shows how to prepare pV3D3 polymeric films using iCVD technology: (i) introduction of vaporized monomers and initiators, (ii) activation of initiators to pyrolyze into free radicals, (iii) monomer and priming The agent radical is adsorbed onto a substrate, (iv) the polymerization radical is converted into the pV3D3 membrane.

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